'semiconductor wafers'

Our ultrasonic cleaners for semiconductors are specialized cleaning systems designed for the precise and thorough cleaning of semiconductor wafers, components, and equipment used in the semiconductor manufacturing industry. Ultrasonic cleaners for semiconductors use cleaning solutions that are specifically formulated to be compatible with the materials and components commonly used in semiconductor manufacturing, such as silicon wafers, photomasks, and other sensitive materials. Most of our systems feature advanced control panels that allow operators to adjust cleaning parameters, including frequency, power, and temperature, to tailor the cleaning process to specific requirements. These cleaners are designed to remove particles, residues, and contaminants down to the nanometer level, crucial for maintaining the quality and performance of semiconductor materials. Features: o Cleaning to the nanometer level o Usage of advanced control panels o Temperature Controller Technical Specifications: o Brand: Waveultra o Power Output (Ultrasonic): 1 kW o Total Volume / Capacity: 40 Litres o Heater Power: 1 kW o Power Input: 230V AC o Frequency: 40 / 68 kHz o Material: SS304/SS316/PP o Basket Size(L x W x H): 300 x 300 x 250 mm o Transducers: PZT type o Temperature Controller: Upto 60oc o Cleaning Agent: Water based solution / Solvent o Tank Size (L x W x H): 350 x 350 x 350 mm o No. of Stages: Multiple o Optional Stages: Rinsing / Pickling / Hot Air Drying

Wafer ultrasonic cleaners are specifically designed to clean individual semiconductor wafers one at a time. This single-wafer approach ensures that each wafer is cleaned with precision. These cleaners predominantly use water-based cleaning solutions or solvents that are compatible with the materials used in semiconductor fabrication. The choice of solution may vary depending on the type of contaminants to be removed. Most of our systems are fully automated and include handling mechanisms to transport wafers from loading to cleaning, rinsing, and drying stages, minimizing human contact and potential contamination. These cleaners are designed to remove submicron particles and nanometer-level residues, crucial for semiconductor manufacturing where even minuscule contaminants can lead to defects. The cleaning process ensures that wafers have particle-free surfaces, which is essential for lithography and other semiconductor fabrication steps. Features: o Fully Automated Systems o Minimum Human Interference o Usage of handling mechanisms Technical Specifications: o Brand: Waveultra o Power Output (Ultrasonic): 1 kW o Total Volume / Capacity: 64 Litres o Heater Power: 1 kW o Power Input: 230V AC o Frequency: 40 / 68 kHz o Material: SS304/SS316/PP o Basket Size(L x W x H): 350 x 350 x 300 mm o Transducers: PZT type o Temperature Controller: Upto 60oc o Cleaning Agent: Water based solution / Solvent o Tank Size (L x W x H): 400 x 400 x 400 mm o No. of Stages: Multiple o Optional Stages: Rinsing / Pickling / Hot Air Drying

This involves the use of a vacuum chamber to remove residual moisture from objects or components that have been cleaned in an ultrasonic cleaner. This process can be particularly useful in applications where thorough drying is essential, such as in electronics manufacturing, laboratory research, and precision cleaning. A vacuum pump is used to create the low-pressure environment within the chamber. This pump removes air and moisture, reducing the pressure inside the chamber. Vacuum drying is highly effective at removing residual moisture, leaving objects completely dry. This is particularly important in applications where moisture can cause corrosion or impact the performance of components. Vacuum drying in ultrasonic cleaners is commonly used in industries such as electronics manufacturing, semiconductor fabrication, optics, and research laboratories. Features: o Removes air & residual moisture o Highly Effective o Temperature Controller Technical Specifications: o Brand: Waveultra o Power Input: 230V AC o Temperature Range: 10˚c to 250˚c o Temperature Controller Type: Digital o Vacuum Range: 0 to 30 Hg o Material: MS Powder Coated o Internal Size(L x W x H): 400 x 400 x 400 mm